EQS-News: ams OSRAM unveils breakthrough Thin-Film VCSEL for AI Scale-Up, showcasing connectorized multi-core fiber solution and expanding ecosystem network
EQS-News: ams-OSRAM AG / Key word(s): Miscellaneous
ams OSRAM unveils breakthrough Thin-Film VCSEL for AI Scale-Up, showcasing
connectorized multi-core fiber solution and expanding ecosystem network
21.09.2026 / 10:00 CET/CEST
The issuer is solely responsible for the content of this announcement.
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ams OSRAM unveils breakthrough Thin-Film VCSEL for AI Scale-Up, showcasing
connectorized multi-core fiber solution and expanding ecosystem network
Moving data efficiently is becoming one of the defining challenges of
next-generation AI systems. As AI clusters continue to scale, optical
interconnects are emerging as critical technology for enabling higher
bandwidth at significantly lower power consumption.
• Expanding ams OSRAM’s Digital Photonics Interconnects platform into AI
scale-up through a growing ecosystem of industry partners
• Introducing next-generation 850nm Thin-Film microVCSEL arrays with
addressability enabling highly parallel „wide-and-slow“ optical
architectures
• Demonstrating error-free 32 Gb/s operation with approximately 0.25
pJ/bit energy efficiency and more than 2,000 hours reliability
validation
• Showcasing a connectorized multi-core fiber solution with ecosystem
partner BizLink
Premstaetten, Austria, and Munich, Germany (21 September 2026) – ams OSRAM
unveils breakthrough Thin-Film VCSEL for AI Scale-Up, showcasing
connectorized multi-core fiber solution and expanding ecosystem network.
As artificial intelligence continues to drive unprecedented growth in
computing infrastructure, moving data efficiently is becoming just as
critical as processing it. The increasing scale of AI training and
inference clusters is placing new demands on optical interconnect
technologies, requiring higher bandwidth, lower latency and significantly
improved power efficiency.
ams OSRAM is expanding its Digital Photonics strategy to address this
emerging opportunity. Building on its leadership in intelligent light
emitters, optical sensors and advanced semiconductor manufacturing and
assembly, the company is unveiling key photonic building blocks required
for next-generation AI infrastructure. These include addressable
micro-emitter arrays based on both LED and VCSEL technologies, as well as
matching micro-photodiode arrays that together form the optical foundation
of future ultra-high-bandwidth interconnect architectures.
At ECOC 2026 in Malaga, ams OSRAM will unveil its latest breakthrough in
Thin-Film VCSEL technology and demonstrate a connectorized multi-core
fiber solution in collaboration with BizLink, maturing the ecosystem for
highly parallel, ultra-low-power optical interconnects for AI Scale-up.
Building a Wide-and-Slow Ecosystem for AI Infrastructure
Following the strategic customer cooperation announced earlier this year
with a confidential industry partner, ams OSRAM continues to broaden its
ecosystem for wide-and-slow optical interconnect architectures.
The company is collaborating with multiple partners across the value
chain, including testing, fiber infrastructure, connector technologies,
packaging and system integration, with the objective of accelerating
industry adoption of next-generation optical interconnect solutions.
BizLink joins this growing ecosystem as a specialist in optical
connectivity and connector solutions and is supporting the development of
the ECOC 2026 demonstrator.
From Adaptive Headlamps to AI Data Movement
The foundations of ams OSRAM’s optical interconnect technology were
established long before the emergence of today’s AI infrastructure market.
ams OSRAM’s optical interconnect technology builds upon the same core
technology platform that enabled the successful commercialization of
EVIYOS™, one of the industry’s most advanced digital lighting solutions.
Combining highly addressable micro-emitter arrays, CMOS integration,
wafer-level manufacturing know-how and advanced packaging technologies,
EVIYOS™ has demonstrated the scalability and manufacturability of ams
OSRAM’s Digital Photonics platform in high-volume production. The platform
has also proven ams OSRAM’s ability to serve demanding markets requiring
consistent quality, reliability and production scalability across millions
of devices.
The same technology principles are now being extended into AI
infrastructure as well as mobile/wearable applications. What began as a
highly addressable micro-emitter architecture for adaptive headlamps is
evolving into a photonics platform capable of moving data with exceptional
energy efficiency and scalability.
Re-thinking Optical Interconnects with Wide-and-Slow Architectures
The rapid scaling of AI clusters is reshaping requirements for
intra-datacenter connectivity. Future AI scale-up networks will require
interconnects that simultaneously optimize power consumption, latency,
density, reliability and cost.
ams OSRAM is targeting this challenge through a highly parallel
wide-and-slow optical architecture. Instead of transmitting increasing
amounts of data through a limited number of highly complex channels, data
is distributed across a large number of lower-speed optical lanes.
Realizing such highly parallel architecture also requires corresponding
advances in fiber and connector technologies, highlighting the critical
importance of the ams OSRAM and BizLink partnership.
This approach reduces overall system complexity while enabling lower
latency, lower power consumption and scalable bandwidth growth. As AI
clusters continue to expand, wide-and-slow architecture offers a promising
path toward more sustainable and cost-efficient infrastructure.
Breakthrough Thin-Film microVCSEL Platform for AI Scale-Up Networks
ams OSRAM continues to expand its photonics portfolio through the
development of a next-generation 850 nm Thin-Film VCSEL platform
specifically designed for AI scale-up interconnects.
The platform combines several differentiating technologies in a single
architecture, including top-emission Thin-Film VCSELs, dense 25 µm pitch
microVCSEL arrays with addressability, silicon TSV integration and
compatibility with standard multimode fiber infrastructure. This enables
highly parallel optical links with exceptional packaging density and
ultra-low-power operation.
The company has successfully completed microVCSEL integration on silicon
TSV substrates and demonstrated error-free 32 Gb/s NRZ operation. The
platform achieves an energy efficiency of approximately 0.25 pJ/bit while
maintaining compatibility with scalable manufacturing approaches. This
level of efficiency highlights the potential of highly parallel optical
architectures to support future bandwidth scaling while minimizing power
consumption.
In addition, reliability testing has shown no failures after more than
2,000 hours under elevated junction temperatures and current overstress
conditions.
Building on these results, ams OSRAM is advancing the development of fully
integrated 3D photonics stacks combining microVCSEL arrays,
micro-photodiode arrays and mixed signal CMOS electronics for future
ultra-high-bandwidth optical interconnect architectures.
ECOC 2026 Demonstrates High-Speed Operation with a Connectorized Fiber
Solution
At ECOC 2026, ams OSRAM will present its most advanced optical
interconnect demonstrator to date together with BizLink, a leading
provider of interconnect, fiber-optic connectivity and optical integration
solutions.
The demonstrator combines ams OSRAM’s 2D addressable 850 nm microVCSEL
array technology with BizLink’s fiber-array integration and optical
connectivity expertise, creating a connectorized multi-core fiber solution
optimized for wide-and-slow data communication.
The system will be demonstrated in a private setting for selected
customers and industry partners during the event.
“AI infrastructure requires a fundamentally different approach to moving
data and wide-and-slow optical architectures deliver a step-change in
power efficiency, latency and scalability. As an integrated
electro-optical engine provider, it’s our role to build out the ecosystem
required to support a scalable industry solution, and we’re excited about
our partnership with BizLink to enable fiber connectivity solutions.” said
Ashkan Seyedi, Vice President and General Manager of Optical Interconnects
at ams OSRAM.
“This demonstrator validates a fundamentally different optical
interconnect architecture optimized for ultra-low power and low latency
operation, by combining ams OSRAM’s addressable microVCSEL technology with
BizLink’s expertise in fiber-array integration, optical packaging and
manufacturing, we have demonstrated the potential of highly parallel
optical interconnects for future AI infrastructure.” said Hendrik
Coldenstrodt, CTO of the Computing and Transportation Business Group at
BizLink Group.
ECOC attendees interested in learning more about ams OSRAM’s optical
interconnect developments are invited to visit booth #1281 and attend the
company’s presentations at the Global Photonics Economic Forum (GPEF
2026).
Additional information on Optical Interconnects and ams OSRAM’s AI
photonics technology can be found on the company’s dedicated [1]technology
page.
About ams OSRAM
The ams OSRAM Group (SIX: AMS) is a global leader in innovative light and
sensor solutions. As a specialist in Digital Photonics, we combine
engineering excellence with cutting-edge global manufacturing to offer our
customers the broadest portfolio of digital light and sensing
technologies.
“Sense the power of light” — our success has ever since been based on a
deep understanding of the potential of light. For 120 years, we have been
developing innovations that move markets: from automotive applications and
industrial manufacturing to medical and consumer electronics. In the
anniversary year of the OSRAM brand, around 19,000 employees worldwide are
working on pioneering solutions alongside societal megatrends such as
smart mobility, artificial intelligence, augmented reality, smart health,
and robotics. This is reflected in over 12,000 patents granted and applied
for. Headquartered in Premstaetten/Graz (Austria) with co-headquarters in
Munich (Germany), the group achieved EUR 3.3 billion revenues in 2025 and
is listed as ams-OSRAM AG on the SIX Swiss Exchange (ISIN: AT0000A3EPA4).
Find out more about us on [2] https://ams-osram.com
ams and OSRAM are registered trademarks of ams-OSRAM AG. In addition, many
of our products and services are registered or filed trademarks of ams
OSRAM Group. All other company or product names mentioned herein may be
trademarks or registered trademarks of their respective owners.
Join ams OSRAM social media channels: [3]>LinkedIn [4]>YouTube
For further information
Investor Relations Media Relations
ams-OSRAM AG ams-OSRAM AG
Dr Juergen Rebel Bernd Hops
Senior Vice President Senior Vice President
Investor Relations Corporate Communications
T: +43 3136 500-0 T: +43 3136 500-0
[5]investor@ams-osram.com [6]press@ams-osram.com
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21.09.2026 CET/CEST This Corporate News was distributed by [7]EQS Group
View original content: [8]EQS News
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Language: English
Company: ams-OSRAM AG
Tobelbader Straße 30
8141 Premstaetten
Austria
Phone: +43 3136 500-0
E-mail: investor@ams-osram.com
Internet: https://ams-osram.com/
ISIN: AT0000A3EPA4
WKN: A118Z8
Listed: Regulated Unofficial Market in Dusseldorf, Frankfurt,
Stuttgart; BX
LEI Code: 5299001JPPT2QFTV5D76
EQS News ID: 2401946
End of News EQS News Service
2401946 21.09.2026 CET/CEST
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